bond tester in a handheld package
|The S-21R offers more power and capabilities than benchtop bond testers. It incorporates all of the bond testing technology, packaging, and user interface enhancements of the MIZ-21SR.With much greater sensitivity, itfs more effective in detecting defects, yet it costs less than benchtop testers. The user interface makes the S-21R much easier and faster to use than other bond testers.With the same high-contrast display as the MIZ-21B and MIZ-21SR, it provides excellent visibility. And at less than four pounds, the S-21R is much smaller than benchtop bond testers, so inspectors can easily maneuver in limited access areas. It stores up to 40 test configurations (20 Sondicator mode, 20 Resonance mode) and can operate more than 12 hours on one battery charge.|
|Sondicator technology: A
Sondicator probe uses a dual element piezoelectric transducer to introduce sound waves
into composite materials. One of the transducer elements is a transmitter, the other a
receiver. If the material being inspected is undamaged, the sound waves travel through the
material in a predictable time period. Any disbonds or delaminations within the inspection
zone attenuate the sound waves (and the material vibrations that they create). This
decreases the energy transmitted beyond that point.
The sondicator method provides digital signatures defining normal and abnormal conditions, displayed as a classic RF waveform format or as an XY screen plot. An experienced technician can interpret these signatures and determine the location and relative size of the disbond condition.
|You can use the S-21R in the Sondicator mode to test for
disbonds or delaminations in composite and metal-to-metal bonded materials. Or, in the
Resonance mode, it can perform more specific thickness checks, confirming a good sound
path through a section of composite, or identifying which layer is disbonded.
The S-21Rfs broad frequency range supports a wide range of applications and probes.
|Resonance technology:Closely related to traditional ultrasonic inspection but in a lower frequency range, this variable frequency test electronically monitors the impedance changes of the contact transducerfs piezoelectric element. Small variations in the tested structure alter the mechanical loading (particle vibration) on the transducer face. This in turn affects the transducerfs electrical impedance. In adhesive bonded materials,changes in the thickness (caused by disbonds) affect the phase and amplitude of the signal at the transducerfs resonant frequency. In multi-layered structures, phase relates to the relative depth of the disbond.|
|Here's the smallest, lightest, most convenient way to perform bond testing. The S-21R can do everything a benchtop tester can do, yet it costs less and is much easier to use. Detect impact damage, disbonds, delaminations, and other anomalies in honeycomb and composite materials. Improved sensitivity to flaws makes testing more accurate. Zetec's display technology offers excellent contrast and resolution.||The Resonance Sweep display automatically calculates the
resonant frequency of the transducer. This instrument identifies the frequency to within 1
kHz for optimum test sensitivity
Memory Non-volatile (data retained with power off):
Probe Configuration Internally switches to interface with probe configurations
|The display provides a 60-degree viewing angle.
|Use the YT display for the initial test setup in Sondicator mode. The sampling gate detects changes in phase and amplitude of the YT signal and converts this to the XY vector display.|